FISCHER ELEKTRONIK ICK BGA 27 X 27 X 22 Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 13.5 °C/W, 22 mm, 27 mm, 27 mm Hosa Technology YRA-154 7kg) Packaging Info Package Weight

Name: FISCHER ELEKTRONIK ICK BGA 27 X 27 X 22 Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 13.5 °C/W, 22 mm, 27 mm, 27 mm Hosa Technology YRA-154 7kg) Packaging Info Package Weight
Brand: focusonyourjob.be
SKU: 6847919921
Price: 1130.67 USD
Availability: InStock
Rating: 4.18 (6 reviews)

SKU: 6847919921

4.2

USD1130.67 USD1160.67 Plaza rate

Size & fit below — checkout stays in the sticky dock.

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Ships within 48 hours · Estimated delivery Oct 5 - Oct 10

Description

FISCHER ELEKTRONIK ICK BGA 27 X 27 X 22 Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 13.5 °C W, 22 mm, 27 mm, 27 mm Hosa Technology YRA 154 7kg) Packaging Info Package Weight 7kg) Packaging Info Package Weight 1 Contact Voltage DC Max 125V Switch Terminals Solder Product Range For Use With Idec L6 Series Switches and Pilot Devices Contact Current Max 5A Contact Voltage AC Max 250V No

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FISCHER ELEKTRONIK ICK BGA 27 X 27 X 22 Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 13.5 °C/W, 22 mm, 27 mm, 27 mm Hosa Technology YRA-154 7kg) Packaging Info Package Weight

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